Over the course of 50 years we have grown to become a global company that develops innovative solutions for our customers, and manages the best interests of our investors, our employees, society and other stakeholders. Read on to discover what we achieved in 2018.



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The demand for smaller, faster and cheaper semiconductor chips continues to rise, driven by advancements in cloud computing, artificial intelligence, smartphones and the Internet of Things.


Our technology is the first step towards making it all possible, as our R&D investment in new materials, new products and new processes means we can help our customers develop their technology roadmap, and further extend Moore’s Law.


In 2018, this led to the introduction of the Synergis ALD tool, which leverages the core technologies from our Pulsar and EmerALD ALD products for high productivity thermal ALD applications. The new Synergis tool allows us to address more ALD applications and therefore increases our served market. Together with our other products and services, this contributed to our strong financial results, which included:

  • net sales of €818 million;
  • bookings of €942 million;
  • operating result of €124 million; and
  • operating cash flow of €137 million.


Strategy & business

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We operate in a fast-paced industry that continues to reshape the world, and our innovative technology enables the semiconductor industry to achieve advancements in computing, communications, energy, transportation, medicine and beyond.
To ensure that we can continue to make a difference to our customers, employees, and company stakeholders, in 2018 we concentrated on the following three key elements of our strategy.


In addition to our fundamental R&D efforts, we continuously expand and deepen our strategic cooperation with key customers, suppliers, chemical manufacturers, and research institutes. This approach enables us to remain innovative and swiftly meet the changing demands of our customers.


We are a key player in the deposition equipment segments for ALD and epitaxy, and a focused niche player for PECVD and vertical furnaces. As a leader in the segment, ALD has turned into a key growth driver for our business, from which we support virtually all of the leading customers in the semiconductor industry. Our newest ALD tool, Synergis, is designed to address a wide range of existing and new ALD applications, effectively increasing the market we serve.


In addition to our internal optimization programs, we are working with our suppliers to improve fundamental quality through statistical methods and process controls. In addition to addressing the technology needs of our customers, we also focus on further increasing equipment throughput and equipment reliability, thereby lowering the cost per wafer of our wafer processing systems.


Performance review

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In 2018, we achieved revenue growth of 11% reaching a record high revenue of €818 million, with sales increasing mainly in the logic, DRAM and analog segments. By industry segment, our 2018 revenue stream was led by memory, closely followed by the logic and foundry segments.


While our ALD product lines continued to be our key sales driver in 2018, accounting for more than half of total equipment revenue, our other product lines also contributed strongly. In our epitaxy product line we increased sales, following the strong growth we achieved in 2017, and we saw additional sales increases in PECVD and vertical furnaces.


Our industry experienced continued growth in 2018, with worldwide semiconductor industry sales increasing by around 14%. This was driven by high memory prices and broad-based electronics demand for cloud services, mobile devices, automotive and industrial applications. These drivers helped the wafer fab equipment market grow by around 10% in 2018.



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Our 2018 sales grew to record levels, reaching €818 million. ALD continued to be the key driver, although the other product lines also made a strong contribution.
We benefited from a further increase in wafer fab equipment spending following the very strong market growth in 2017. Our operating profit increased to €124.3 million from €113.2 million in 2017, while the operating profit margin remained stable.


New bookings increased by 22% in 2018 to €942 million, with equipment bookings for ASMI as a whole led by logic, followed by foundry and then memory. Total research and development (R&D) expenses, excluding impairment charges, decreased by 1% in 2018 compared to 2017, mainly as a result of higher capitalization of development expenses.


Financial statements

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Our 2018 sales grew to record levels, reaching €818 million. ALD continued to be the key driver, although the other product lines also made a strong contribution.
We benefited from a further increase in wafer fab equipment spending following the very strong market growth in 2017. Our operating profit increased to €124.3 million from €113.2 million in 2017, while the operating profit margin remained stable.


New bookings increased by 22% in 2018 to €942 million, with equipment bookings for ASMI as a whole led by logic, followed by foundry and then memory. Total research and development (R&D) expenses, excluding impairment charges, decreased by 1% in 2018 compared to 2017, mainly as a result of higher capitalization of development expenses.


Other Information

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During 2018, we returned approximately €607 million to shareholders in the form of dividends, share buybacks and the capital return. This was up from €281 million in 2017 and €140 million in 2016.
Over the 2010-2018 period, we returned more than €1.6 billion to the financial markets through dividends, share buybacks, return of capital, and buyback of convertible bonds.


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In 2018, we paid a dividend of €0.80 per common share and we will propose to the forthcoming AGM to declare a dividend of €1.00 per share for 2019. The proposed 2019 dividend will mark the ninth consecutive year that we have paid a dividend.

Explore how we help our customers achieve their technology roadmaps


The world around us is changing rapidly, as society becomes increasingly automated and connected. We rely on a broad range of electronic devices, often connected, to control our homes, offices, vehicles, and communications, whereby mobile devices are evolving in many forms. We operate in a fast changing world, wherein semiconductors are becoming more and more part of everyone's life.

Over time these devices have become smarter, for example enabling office building environments and public transportation to be optimized in real time, without human interaction. They also allow individuals to speak to their electronic personal assistants for guidance, carry out information searches, or to execute tasks. Another example is artificial intelligence, where advanced processors and computing networks are used to automate decision making and action taking. Smart cars and trucks are driving autonomously. This connected and automated world is creating the demand for massive amounts of data, requiring ever-greater computer processing power and storage, capable of analyzing and acting on the data quickly and effectively. Making this possible requires the constantly increasing processing power of semiconductor chips. And it is our technology that is playing a vital part in making it all possible.


A key driver in the semiconductor industry is the continuous demand for smaller, faster, and cheaper semiconductor components. Through technology advances in the manufacturing process, semiconductor manufacturers are continuously scaling chips to smaller dimensions. This enables more transistors to fit in the same physical space, thereby reducing the costs and increasing the speed and performance of a device.  Moore's Law states that the number of transistors in an integrated circuit will double approximately every two years, and the cost per transistor will reduce by half over the same time frame. The industry’s relentless push to follow Moore’s Law and the continuous demand for smaller, faster, and cheaper semiconductor components drives the technology advances in the semiconductor manufacturing process.


We serve the wafer processing equipment segment, which is part of the capital equipment segment. Demand for semiconductor capital equipment is driven both by growth in the market for semiconductor devices and the new technology needed to realize the next generation of devices.


  • ASMI supplies equipment to the leading semiconductor manufacturers in the logic, foundry, and memory markets, primarily for the deposition of thin films;
  • The logic market is made up of manufacturers who create chips that are used to process data. Known as the central processing unit (CPU), this microprocessor is the ‘brains’ of a computer system, and can be found in smartphones, laptops, and computers;
  • The foundry market consists of businesses that operate semiconductor fabrication plants to manufacture the designs of other so-called fabless semiconductor companies, and
  • The memory market covers manufacturers who make chips that store information either temporarily, such as Random Access Memory (RAM), or permanently, such as NAND non-volatile memory. The NAND memory market has evolved to include 3D-NAND chips, which are designed for the vertical stacking of memory cells to increase bit density.


We also supply equipment to leading manufacturers of analog semiconductor devices, which are important for enabling the growing semiconductor content used in most products worldwide.

The analog market includes a wide array of chip types, including:

  • power management;
  • signal processing;
  • MEMS;
  • sensors;
  • discretes; and others.

A few years ago, the industry adopted the phrase ‘More than Moore’, to identify and acknowledge a strongly-growing market of various types of analog chips which are not driven by the same Moore’s Law technology scaling inflections of mainstream logic and memory chips. But these 'More than Moore' devices often have their own technology challenges. For example power devices typically require relatively thick layers of epitaxial silicon, which is challenging for epi chamber performance in volume production.


We design, manufacture, and sell wafer process equipment and services to our customers for the production of semiconductor devices, or integrated circuits (ICs). Semiconductor ICs, often called chips, are a key technology that enable the advanced electronic products used by consumers and businesses everywhere. Our innovative technologies are used by the most advanced semiconductor manufacturers in their wafer fabrication plants.

Our customers’ goal is to build faster, cheaper, and more powerful semiconductors. We work closely with them to make this a reality, forging mutually beneficial partnerships that enable us to help them develop their technology roadmap. At the same time, our customers become expert users of our equipment, and their insights help us to continuously improve our systems, resulting in greater productivity and lower operating costs per wafer, benefiting us, them, and the end consumer. The result is value creation not only for our customers, but for all of our stakeholders. Furthermore we provide an overall benefit to society by helping our customers produce the chips needed for advanced electronics that deliver a world of improvements and opportunities.

Creating this stakeholder value requires a strong, well-educated workforce, enabling us to develop and maintain technologies at the edge of what is technologically possible. But we cannot achieve this on our own. This is why collaboration is such a vital part of our success, and why we have developed close ties with many of our stakeholders. For example, we maintain partnerships with technical institutions and universities to carry out cutting-edge research and development (R&D). At the same time, working closely with our suppliers helps us manufacture, service, and sustain our products efficiently.


The process of making semiconductor chips at our customers' premises is both highly complex and very costly. Semiconductor fabrication plants, called fabs, house a large set of wafer-processing equipment which perform a series of process steps on round silicon wafers, which are typically 300mm in diameter. The equipment is operated in cleanrooms, which filter the air to avoid contamination from small particles that could negatively affect the circuitry on the chips. The dimensions of the features within each chip continue to get smaller, as the demand for performance continues to expand. Certain chips are also getting taller, such as 3D-NAND memories, where density is increased by stacking layers vertically.

Many individual steps are performed using various types of wafer process equipment to create a semiconductor chip, including photolithographic patterning, depositing thin-film layers, etching to remove material, thermal treatments, and other steps. Our systems are designed for deposition processes when thin films, or layers, of various materials are grown or deposited onto the wafer. Many different thin-film layers are deposited to complete the full sequence of process steps necessary to manufacture a chip. After testing the individual circuits for correct performance, the chips on the wafer are separated and then packaged in a protective housing before ultimately becoming part of a set of semiconductor chips on circuit boards within an electronic product.



Over the past 50 years we have grown to become a leading global supplier
of semiconductor wafer processing equipment. A company that develops
innovative process solutions for our customers, and manages itself in the best
interests of our investors, our employees, society, and other stakeholders.

Yet now is the time to enter a new era of innovation, to embark on the next
phase of growth. We understand that this requires commitment and strength
across many areas. From innovation in R&D, to advancing new technologies
and addressing new applications. From developing our people, to creating
even stronger relationships with key customers.

This is how we will take the next leap forward.


Of new materials






Our roadmap to the future will enable us to not only
achieve our next phase of growth, it will ensure we
can continue to help our customers achieve their
technology roadmaps for next-generation devices.


Our technology helps drive innovation, increasing the number of scientific breakthroughs, many of which are achieved from our advanced process equipment that deposits new materials with precision and productivity, positively benefiting society in sectors from healthcare and education, to transport and energy.


For semiconductor manufacturers, scaling chips
to smaller dimensions is an ongoing challenge.
Our innovations and equipment are vital in helping make many of these transitions happen.


Striving for efficiency ensures that our
customers get the products, services,
and results they expect. Intensifying
our focus on efficiency will make us a
stronger company, ready to take the
next leap forward.







We are a multinational company that
embraces diversity in every sense
of the word. With 29 different
nationalities working across the
company, we combine our talents
to drive innovation.


Achieving our ambitions takes intelligence, knowledge, skill,
determination, and dedication. And it is this combination of
qualities that we nurture in our people.


Our goal is to impact tomorrow’s generation
as positively as we’ve impacted today’s.
Making this happen takes the xtraordinary
talent of our people, who work together
to drive innovation and deliver excellence.

Expanding the






Collaboration is fundamental to our
continued success; from working
with our customers to optimize our
equipment and processes to enable
their technology roadmaps, to
creating partnerships on cutting-edge
research and development.


Operational excellence is one of the essential
pillars of our strategy, which enables us to provide
our customers with the high-quality, leading-edge
products and services they demand.


R&D is central to our development,
leading to new device architectures,
new materials, and new processes
that strengthen our competitive
positioning and enable our customers
to deliver the next-generation chips.


By extending our technological scope with a
more diverse product portfolio, we can help our
customers continue to advance their business
while growing our own in new market segments.

Moore with






We create long-term value for our
stakeholders in a variety of ways.
From working with our customers
to develop innovative solutions, to
ensuring value creation growth
and positive investor returns.


We are committed to positively
contributing to society and
reducing our impact on the
environment. Only then can
we truly say we are helping
create more with less.


We believe sustainability takes many forms.
From developing sustainable technology
roadmaps for our customers, to creating
a sustainable living environment for all.


Safety is a front-line requirement,
which is why our ZERO HARM!
policy outlines our vision on product
safety, and our CR policy lays out
our commitment and expectations
towards health and safety.